III-V Workshop |
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International Consortium for Advanced Manufacturing Research |
ICAMR invites you to a workshop focused on III-V manufacturing scale integration on Si wafers for advanced sensors, photonic and semiconductor devices based on advanced semiconductor platforms. The miniaturization of microelectronics has been the guidance for research and development in the semiconductor industry over the last decades and is driving the transition to these new materials. This transition also requires the equipment for high volume manufacturing (HVM) to be developed and optimized for these new materials and processes. In the recent updates of the International Technology Roadmap for Semiconductors (ITRS), the focus has been on emerging research materials (ERM). In 2011 the ITRS upgraded some of the III-V materials (n-III-V and p-Ge) into the ERM list, the Process Integration, Devices, and Structures (PIDS) chapter and the Front End Processes (FEP) chapter marking their relevance as alternate channel materials for HVM in the semiconductor industry.
This workshop will identify the key applications that drive the need for III-V and other novel materials to be incorporated on manufacturing scale (200, 300 mm) Si wafers. The growing demand of devices with the need for low cost and high conversion efficiency coupled with high reliability and an increase in functionality and applications, particularly in harsh environments, has led the semiconductor technology development look beyond Si, into emerging research materials such as III-V’s. The recent trend predicts the need for intelligent and connected devices which can be enabled by such materials. The workshop is designed to address the key challenges associated with the III-V integration on a Si based platform for high volume manufacturing. Additionally subjects like modeling, testing, reliability, and, packaging will be discussed. Also, the difficulties the industry will face in terms of pre-competitiveness, penetrating the market, ramping up the production of these III-V materials, deposition, Environment, Health and Safety (EHS), process and quality controls, will be discussed.
This workshop will feature presentations from industry, research partners and equipment suppliers; it will invite participants to discuss the challenges and gaps associated with HVM of these advanced materials and devices. Not only will the workshop help identify the needs of the industry for these next generation HVM processes, it will also allow this select group of invitees to network, share their respective knowledge and guide the future of the semiconductor industry.
Identify the challenges across the complete process and supply chain (materials, equipment, metrology, modeling, test & reliability, packaging, device integration, wireless communication, EHS, standards, etc.) that lead to cost effective solutions in implementing emerging materials onto the well-established Si platform for advanced sensor, photonic and semiconductor applications.
The workshop will bring together key industry participants with significant experience in the processing and manufacturing of these materials with existing technology platforms and business plans to transition to the new HVM processes and platforms. Participants of the workshop will include select representatives from industry, equipment suppliers, national laboratories and universities with key core competencies in these fields.
Provide workshop participants with the presentations and workshop information collected in the process of identifying the challenges related to the HVM of the III-V materials.
Help align efforts that accelerate solutions to pre-competitive and common challenges critical to advanced manufacturing of these future products
7:30 am |
Registration / Continental Breakfast |
8:00- 8:10 |
Workshop introduction and expected outcomes: Dan Holladay (ICAMR) |
8:10-8:15 |
Round table introduction of all invited participants |
8:15- 8:45 |
Jeffrey R. LaRoche from Raytheon |
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Topic: Challenges facing manufacturing scale-up of next generation devices utilizing III-V and other novel materials |
8:45- 9:15 |
Greg Peake from Sandia National Laboratories |
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Topic: Transition of III-V materials from lab to fab |
9:15-9:45 |
Industry / International Institutes spokesperson |
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Topic: Device Integration and processing challenges for the HVM of III-V materials |
9:45-10:00 |
Group Activity – Listing/Voting/Prioritization Process explained |
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Break |
10:10-11:30 |
Identify key technology issues in III-V applications and manufacturing issue categories (Deposition, Packaging, Device Integration, EHS, Standards, Others) |
11:30-11:45 |
Champions for each “Key Technology Issues” category will solicit inputs from the team to identify and discuss the specific challenges related to each of the categories – they will then be scored to better understand overall impact to the industry |
11:45-12:00 |
Workshop findings, wrap-up and action items |
Create a team of industry experts willing to lead future workshops based on the key technology issue categories
ICAMR to work with industry, institutes and trade associations (SEMI, SRC, etc.) to provide partners with a detailed Technology Roadmap for HVM of III-V and other Novel Materials
Amit Kumar
(407) 742-4255
Amit.Kumar@ucf.edu
Please RSVP to Amit.Kumar@ucf.edu or alternatively follow the link below to register: https://www.eventbrite.com/e/high-volume-manufacturing-of-iii-v-and-other-novel-materials-on-si-based-wafers-for-smart-sensors-tickets-17338585175
